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I Elprint benytter vi vårt velkjente MIX-prinsipp, hvor standardoppbygginger av 1-, 2-, og 4-lags mønsterkort blir mixet med andre mønsterkort med de samme spesifikasjoner. Slik oppnås en bedre utnyttelse av produksjonspanelet og det er flere til å ”dele” på de faste kostnadene. Dette medfører at du som kunde får lavere priser på mønsterkort som kan mixes. Her på siden kan du se vår kapabilitet - både hva angår standard mønsterkort på mix og vår generelle kapabilitet for alle typer mønsterkort.
For at ditt mønsterkort skal kunne mixes må det oppfylle noen krav som er spesifisert i boksen umiddelbart under.
For flere tekniske opplysninger kan du med fordel lese nærmere om mønsterkort her på siden eller på www.macaos.com.
Hent en printervennlig PDF av vår kapabilitet. |
| Production time |
Minimum 2 days |
| Shipment time |
2 days |
| Base materials |
FR4
FR4 High TG
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| Product range |
1, 2 and 4 layer.
1.6 mm; 35 um copper in all layers.
4-layer have unspecified distance between layers.
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| Surface finish |
Lead-free HASL |
| Solder mask |
Color: Green
Bridge: 0.1 mm
Over size (C): 0.1 mm
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| Component printing |
White
Minimum 0.125 mm track width
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| Hole, minimum size (A) |
0.30 mm |
| Conductor width (D) |
0.125 mm |
| Conductor spacing (E) |
0.125 mm |
| Annular ring (B) |
0.15 mm |
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| A |
Finished hole size. Plated or non plated |
| B |
Annular ring: (pad size – hole size) / 2 |
| C |
Soldermask opening |
| D |
Conductor width |
| E |
Conductor spacing |
| F |
Solder mask bridge |
| G |
NPTH to copper |
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Standard |
Special |
| Production standard |
IPC 6012C, Class 2 |
IPC 6012C, Class 3
Perfag
Any special requirements
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| Production time |
5 days |
1-2 days |
| Shipment time |
2 days |
1 day. 3 days -3 weeks on series |
| Base materials |
FR4
FR4 High TG
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Rogers
Aluminium core/carrier
Polyimide (flex & rigid)
Arlon
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| Product Range |
Single sided, double sided
Multilayer
Prototypes
Small & large production series
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High density interconnect (HDI)
Flex, Rigid-Flex
Metal core/carrier (Alu)
Impedance controlled PCBs
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| Board size |
Min 25×25, if smaller PCB must be panelized
Max 500×600 mm
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Max 520-720 mm?? |
| PCB thickness |
1.6 mm standard, ± 10% |
FR4: 0.1 – 6.0 mm
Min. inner layer: 0.05 mm
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| Copper thickness |
35µ
Plating: 20µ for IPC Class 2
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12-200µ
Plating: 25µ for IPC Class 3
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| Surface finish |
Lead free HASL
ENIG (chem. NiAu)
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Silver
Chemical Tin
Hard Gold
HASL (Non RoHS, with lead)
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| Mechanical processing |
Routing (2.4, 2.0, 1.6 mm)
Routing tolerance: ±0.20 mm
Scoring (PCB thicnkess: 0.8-2.4 mm)
Scoring, min dist. Copper: 0.4 mm
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Min. routing tool: 0.6 mm dia.
Routing tolerance: ±0.10 mm
Plated edges
Depth controlled routing
Castellated holes (half moon holes)
Blind & buried vias
Peelable (blue) mask
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| Holes |
Mechanical: 0.25-6.2 mm
Aspect ratio Through hole: 1:10
Aspect ratio blind hole: 1:1
Finished hole dia. tolerance: ± 0.1 mm.
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Mechnical: 0.10 mm
Laser drill: 0.1 mm (0.07 mm possible)
Aspect ratio Through hole: 1:20
Plugging: with solder mask, copper, non conductive paste. Overplate possible.
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| Solder mask |
Color: Green
Bridge (F): 0.1 mm
Over size (C): 0.1 mm
Thickness, typical: 8-40µ
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Color: Red, white, black & blue
Bridge (F): 0.07 mm
Over size (C): 0.075 mm
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| Component printing |
Color: White
Minimum line width: 0.125 mm
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Color: Yellow & Black
Minimum line width: 0.1 mm
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| Data formats |
Macaos orders
Gerber Extended, drill files
ODB++
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Basic Gerber
pdf, doc, xls ect.
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Minimum distances:
– Npt – copper
– Outline – copper
– Scoring – copper
– Copper – copper
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See tables below
0.2 mm
0.4 mm
See tables below
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See tables below
0.1 mm
0.3 mm
See tables below
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Outer layer, copper thickness and line/space. Cheapest (Minimum)
| Starting copper thickness |
Line width (D) |
Line space (E) |
NPTH – copper (G) |
| 18µ (43 plated)* |
150µ (100µ)** |
150µ (100µ)** |
200µ (150µ) |
| 35µ (70 plated) |
200µ (150µ) |
200µ (150µ) |
225µ (175µ) |
| 70µ (105 plated) |
300µ (250µ) |
300µ (250µ) |
250µ (200µ) |
| 105 (140 plated) |
400µ (300µ) |
400µ (350µ) |
300µ (250µ) |
| 140µ |
500µ (400µ) |
500µ (400µ) |
400µ (300µ) |
| 210µ |
600µ (500µ) |
600µ (500µ) |
500µ (400µ) |
| *) Commonly known as 35µ/1oz. |
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| **) Down to 50µ width/space on 9µ base copper. |
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Inner layer, copper thickness and line/space. Cheapest (Minimum)
| Starting copper thickness |
Line width (D |
Line space (E) |
NPTH – copper (G) |
| 18µ |
125µ (75µ) |
125µ (75µ) |
(300µ) |
| 35µ |
150µ (100µ) |
150µ (100µ) |
(300µ) |
| 70µ |
250µ (200µ) |
250µ (200µ) |
(300µ) |
| 105 |
300µ (250µ) |
300µ (250µ) |
(300µ) |
| 140µ |
500µ (350µ) |
500µ (350µ) |
(400µ) |
| 210µ |
600µ (500µ) |
600µ (500µ) |
(500µ) |
Stenciler
| Maximum size |
595×595 mm |
| Thickness |
100, 120, 130, 150, 180, 200, 250µ |
| Treatment |
Electro polished |
| Etching |
Up to 2 thicknesses pr. stencil. Etch down in 10µ steps from base thickness.
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| Minimum opening size |
50µ |
| Minimum distance opening to opening |
150µ |
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